Maximizing regeneration efficiency with reliable technology.
Polishing slurries primarily use abrasives and DI Water for wafer planarization, and they also include additives like dispersants for particle stabilization, oxidizers, pH adjusters, and corrosion inhibitors, depending on the characteristics of the semiconductor film being polished.
Environmental protection is our starting point, and social value is our direction.
We are growing into a company that realizes the ESG vision by creating a sustainable industrial ecosystem through resource recycling.
Reusing chemical raw materials — abrasives and ultrapure wate r— can significantly reduce the amount of slurry and wastewater used in the production process.
The effect of reducing exhaust fumes from the transport of raw material slurry and wastewater treatment chemicals, as well as the chemical agents used in wastewater treatment.
Expectation of quality assurance and maintenance of process quality through the reuse of recovered raw materials.
Slurry recycling is expected to reduce the occurrence of micro-scratches and increase production yield.
The recycled slurry can be used without sedimentation because it is supplied directly to the production process without designated storage space or logistical transfer distance.
Polishing particles and chemicals can be recovered from impurities, and pure DI water can be extracted from that mixture, allowing for UPW recycling.
We secure slurry particle stability using Electric-Sonic technology and control the entire process in real-time with a Real-Time Monitoring system. We achieve uniform quality and high efficiency through precise control and immediate data feedback, completing a next-level smart process environment.
Slurries, which consist of an abrasive and DI Water for wafer planarization,
contain additives such as dispersants, oxidizers, pH adjusters, and corrosion inhibitors for particle stabilization,
depending on the type of semiconductor film being polished.
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